Nashville, TN – November 28, 2024
Sensorium Technological Laboratories (Sensorium), a deep-tech innovator in nanophotonic sensing technologies, today announced the appointment of Samer Hamdan as Head of Advanced Packaging Initiatives. Mr. Hamdan will lead the company’s expansion into metrology and defect detection solutions for next-generation semiconductor packaging applications. Mr. Hamdan brings over 26 years of experience from Samsung Semiconductor, where he most recently led a metrology and inspection organization comprising more than 250 engineers in Austin, Texas. His deep domain expertise in high-volume semiconductor manufacturing, advanced metrology systems, and inspection methodologies will be instrumental as Sensorium accelerates development of its AI-enhanced hyperspectral imaging platform for advanced packaging.
“Samer’s leadership and experience in the metrology space are unparalleled,” said David J. Ferran, CEO of Sensorium. “His insight into both the technical and operational aspects of advanced packaging is a perfect match for Sensorium as we bring our nanophotonic and AI technologies to market.”
Based in Austin, Mr. Hamdan will build and lead a new product development team dedicated to advanced packaging and will spearhead efforts to integrate Sensorium’s proprietary nanophotonic materials and AI models into commercial solutions that address the evolving challenges of chiplet-based and 3D integration technologies.
About Sensorium Technological Laboratories
Founded in 2022 by Prof. Joshua Caldwell (Vanderbilt University) and Prof. Simone De Liberato (University of Southampton), Sensorium develops precision sensing and imaging technologies rooted in breakthrough research in nanophotonics and quantum electrodynamics. The company’s initial products focuses on ultra-precise sensing of trace gases in semiconductor manufacturing environments, with expanding applications across industrial and defense sectors.